HDI process capability
| Serial No | Item | Technical Parameters |
| 1 | Base Material | FR-4｜High Tg｜Halogen-free｜PTFE｜ Ceramic PCB｜ Polyimide |
| 2 | Board Type | PCB｜FPC｜R-FPC｜HDI |
| 3 | Hignest Layer | 64 Layer |
| 4 | Minimum base copper thickness | 1/3 OZ (12um) |
| 5 | Maximum finished copper thickness | 8 OZ |
| 6 | Minimum trace / gap (Inner layer) | 2/2mil (H/H OZ base copper) |
| 7 | Maximum produce size | 609*889mm |
| 8 | Minimum trace / gap (Outer layer) | 2/2mil (1/3 OZ base copper) |
| 9 | Minimum distance from hole to inner conductor | 6mil |
| 10 | Minimum distance from hole to outer conductor | 6mil |
| 11 | Minimum over-hole solder ring | 3mil |
| 12 | Minimum component solder ring | 5mil |
| 13 | Minimum BGA pads | 8mil |
| 14 | Minimum BGA Pitch | 0.4mm |
| 15 | Minimum Finished Hole Diameter | 0.15mm(CNC)｜0.1mm(Laser) |
| 16 | Maximum board thickness to hole diameter ratio | 20:1 |
| 17 | Minimum solder resist bridge width | 3mil |
| 18 | Soldermask / circuit processing method | Film｜Laser Direct Imaging |
| 19 | Minimum insulation layer thickness | 2mil |
| 20 | HDI & Specialty Boards | HDI(1-7 steps)｜R-FPC(2-16 layers)｜High frequency mix-pressing(2-20 layers) |
| 21 | Surface Finish Type | Immersion gold(ENIG), HASL lead free, Immersion tin, Immersion silver, OSP, Full board gold plating, Immersion gold + OSP |
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PCB
Assembly
Capabilities
About
Contact
- Building 18, Shayi North Yongfa Science Park, Xinhe
Road, Shajing Street, Bao'an District, Shenzhen, China
- Email:[email protected]
- Skype:live:.cid.7087a9ce83b3216b
- WhatsApp:8615989328210
- Tel:+86 159 8932 8210
- Fax:0755-81772911
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