Category | Capability | Details |
Board Size | Min(pcs) | 1*0.5mm |
Max (Pnl Size) | 250*1200mm | |
Base Material Thickness | 0.06——0.3mm | |
Board Thickness | 0.1-0.5mm | |
Base Copper Thickness | 1/3OZ——2OZ | |
PTH Hole Wall Copper Thickness | 8-20μm | |
Blind Hole Filling Capacity Aspect Ratio (Hole Size: Hole Depth) | 0.048611111 | |
Blind Hole Filling Capacity (Hole Size) | 50-150μm | |
Single Line Impedance Tolerance | ±10% | |
Differential Impedance Tolerance | ±10% | |
Min Track/Spacing (Double Layers Board) | Surface Copper Thickness:8-14μm | 40/40 um |
Surface Copper Thickness:15-20μm | 45/45 um | |
Surface Copper Thickness:21-30μm | 55/55 um | |
Surface Copper Thickness:31-40μm | 75/75 um | |
Surface Copper Thickness:≥40μm | 80/80 um | |
Line Width Tolerance | Line Width≤0.050mm | ±.02mm |
0.05mm<Line Width≤0.15mm | ±20% | |
Line Width>0.150mm | ±10% | |
Silkscreen | Silkscreen Character Min Width/Spacing | 4mil |
Solder Mask | Green Solder Mask Thickness Range | 10~30 μm |
Related Capacity | Dimension Tolerance from Line Edge to Plate Edge | ±0.25 mm |
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