Rigid-Flex process capability
| Category | Small and Medium Batches Order (Order area ≥10㎡) | Prototype Order (Order area < 3㎡) | |
| Poduct structure | 1+n+1; 1+1+n+1+1; 2+n+2 | 1+n+1, 1+1+n+1+1, 2+n+2 | |
| F+R, cu+F+cu, R+F+R+F+R, R+F+R | F+R, cu+F+cu, R+F+R+F+R, R+F+R | ||
| Number of layers | Rigid-flex PCB | ≤18L | ≤24L |
| FPC | ≤10L | ≤16L | |
| Board thickness (mm) | Rigid-flex board | 0.3-3.2 | 0.3-3.2 |
| FPC | 0.06-0.35 | 0.06-0.35 | |
| Board size (mm) | Rigid-flex PCB | 15*15 to 310*510 | 15*15 to 310*510 |
| FPC | 5*15 to 310*510 | 5*15 to 310*510 | |
| Copper thickness (OZ) | Maximum copper thickness of FR-4 | Outer layer 2OZ, inner layer 2OZ | Outer layer 2OZ, inner layer 2OZ |
| Maximum copper thickness of FPC | Outer layer 1 OZ, inner layer 1 OZ | Outer layer 2 OZ, inner layer 2 OZ | |
| Minimum copper trace width and spacing capability (um) | 75/75 | 75/75 | |
| Minimum diameter of mechanical drill (mm) | 0.2 | 0.15 | |
| Rigid part material | Tg170 | S1000-2M,IT180A | S1000-2M,IT180A |
| High TG halogen-free | S1165 | S1165 | |
| Thickness of dielectric layer (mm) | 0.1-3.2 | 0.075-3.2 | |
| Flex part material | Flexible material | PI DuPont, Panasonic, Shengyi | PI DuPont, Panasonic, Shengyi |
| Surface insulation layer | Cover film, soldermask | Cover film, soldermask | |
| Thickness of dielectric layer (mm) | 0.025-0.1 | 0.012-0.1 | |
| Surface treatment | Rigid-flex board | HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger , immersion gold + OSP | HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger, immersion gold + OSP |
| FPC | FPC | HASL with lead / lead-free, immersion gold, OSP | |
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PCB
Assembly
Capabilities
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