Difference between a standard PCB and thick copper PCB

Standard PCBs can be produced with copper etching and plating processes. These PCBs are plated to add copper thickness to planes, traces, PTHs, and pads. The amount of copper used in the production of standard PCBs is 1oz. In the production of heavy copper PCB, the amount of copper used is greater than 3oz.

For standard circuit boards, copper etching and plating techniques are utilized. However, heavy copper PCBs are produced via differential etching and step platting. Standard PCBs perform lighter activities while heavy copper boards perform heavy duties.

Standard PCBs conduct lower current while heavy copper PCBs conduct higher current. Thick copper PCBs are ideal for high-end applications due to their efficient thermal distribution. Heavy copper PCBs have better mechanical strength than standard PCBs. Heavy copper circuit boards enhance the capability of the board in which they are utilized.

Other features that make thick copper PCBs different from other PCBs

Copper weight: This is the main distinguishing feature of heavy copper PCBs. Copper weight refers to the weight of the copper used in a square foot area. This weight is usually measured in ounces. It indicates the copper’s thickness on the layer.

Outer layers: These refer to the external copper layers of the board. Electronic components are usually bonded to the external layers. The external layers begin with copper foil which is coated with copper. This helps to increase the thickness. The copper weight of the external layers is preset for standard designs. Heavy copper PCB manufacturer can alter the weight and thickness of the copper to suit your requirement.

Inner layers: The dielectric thickness, as well as the copper mass of the internal layers, is predefined for the standard projects. However, the copper weight and thickness in these layers can be adjusted based on your needs.

Applications of heavy copper PCB

Heavy copper PCB offers some outstanding features that make it ideal for certain applications. This type of PCB is used in military and defense applications. The demand for heavy copper PCBs has been increasing over the years. This is because these PCBs are used in several applications such as;

· Rail traction systems

· UPS systems

· Solar power converters

· Nuclear power industries

· Automotive industries

· Torque controls

· Power line motors

· Welding equipment

· Military equipment

· Safety and signal systems

· Protection relays

Conclusion

Heavy copper PCBs are produced via etching and plating methods. The major aim in the production of this PCB is to add copper thickness through sidewalls and plated-through holes. Heavy copper PCBs have several benefits which make them in high demand.

Due to their outstanding features and benefits, they can meet your electrical requirements. These circuit boards will always dissipate heat generated due to heavy currents conduction. Electronics using heavy copper boards have been in use for a long time. Heavy copper can carry high currents. These boards will continue to meet the needs of various applications.

High power circuit wirings can be developed using Heavy Copper PCBs. Such a wiring mechanism offers more reliable thermal stress handling and offers fine finishing while incorporating multiple channels on a single layer of a compact board.

Heavy Copper PCBs are widely used in various products as they provide multiple features for improving circuit performance. These PCBs are widely used in high power equipment such as transformers, heat sinking, power inverters, military equipment, solar panels, automotive products, welding plants, and power distribution systems.

Heavy Copper PCB generally need to adopt a special pressing procedure. It involves the use of multiple PP fillings to meet the required filling during the pressing process. The pressing involves high pressure and a large flow of glue. There are empty areas in the heavy copper PCB in each layer of the inner layer pattern; there is no copper in the open area. Also, the edge of the plate is designed with a single air guide groove.

Due to the high pressure, the amount of PP glue passes very easily, and the air guide grooves are lost. This causes the thickness of the board in the open area to be too thin. The board’s overall thickness is extremely large, which causes the film to be not tight during the subsequent processing of the outer layer, ultimately causes the product to be not useable.

The priority is to reduce the flow of glue in the open area and prevent the open area’s thickness from being too thin. This is an urgent problem to be solved in the production process for such heavy copper PCB .

How to solve issue of the uniform thickness in the production of heavy coppy PCB

1.This is amethod for manufacturing a heavy copper PCB with uniform thickness. Each inner core plate of the heavy copper PCB is provided with a copper-free open area at the same position, which includes the following steps:

    · Cut the material to obtain the inner core board. Through the inner layer pattern and etching process, the inner layer lines are made on each inner core board, and some copper PADs are staggered on the edge of the open area of each inner core board.  Made each inner layer board.

    · The inner layer board and the outer layer copper foil are pressed together by the prepreg to make a multi-layer production board.

    · Post-processing the multi-layer production board according to the existing technology to obtain a thick copper board.

2.The method for manufacturing a heavy copper PCB with uniform thickness according to claim 1, wherein the copper PAD in step S1 has the same shape and size, all of which are round, oval, diamond, or square.

3.This is a method for manufacturing thick copper plates with uniform thickness according to claim 2. The radius of each copper PAD is R, and at least two rows of circular shapes are provided on the edge of the open area of the inner core plate. The copper PADs in each row are arranged equidistantly along the long edge of the board. The center distance between two adjacent copper PADs is any two adjacent copper PADs in each row. 

The bottom copper PAD is called the bottom copper PAD. The copper PAD between the bottom copper PAD is the corresponding vertex copper PAD. The center of each bottom copper PAD and the corresponding vertex copper PAD are connected to form an isosceles right triangle.

4.A thick copper plate with uniform thickness is comprised of at least one inner layer core plate. Each inner layer core plate is provided with a copper-free open area and at the same position, characterized in the open area of the inner layer core plate. Several copper PADs are staggered on the edge of the board.

5.The heavy copper PCB with uniform thickness according to claim 4, wherein the shape of the copper PAD is a circle, an oval, a diamond, or a square.

6.The heavy copper PCB with uniform thickness according to  5, each copper PAD has a radius R, and at least two rows of circular copper PAD are provided on the edge of the inner core plate’s open area. The copper PADs in each row are arranged equidistantly along the long edge of the board. The center distance between two adjacent copper PADs is any two adjacent copper PADs in each row; 

they are called bottom copper PADs. Adjacent rows are located on the bottom side. The copper PAD between the copper PADs is the corresponding vertex copper PAD. The center of the two base copper PADs and the corresponding vertex copper PAD centers form an isosceles right triangle.

Mass production lead time

The above lead time is based on:

1.Conventional Material

2.All engineering consultations is confirmed