PCB process capability-Shenzhen Honlynn Circuit Co., Ltd.

PCB process capability

N0	ITEM	Technical capabilities
1	Layers	2-32 layers
2	Max.Board Size	1200mm*625mm
		47"*25"
3	Finished Board Thickness	0.15mm--10.0mm
		0.006"--0.4"
4	Finished Copper Thickness	35um-420um
		1OZ--12OZ
5	Min.Trace Width/Space	0.075mm/0.075mm
		0.003"/0.003"
6	Min.Hole Size	0.1mm
		0.004"
7	Hole Dim. Tolerance(PTH)	±0.05mm
		±0.002"
8	Hole Dim.Tolerance(NPTH)	+0/-0.05mm
		+0/-0.002"
9	Drill Location Tolerance	±0.05mm
		±0.002"
10	V-Score Degrees	20-90度
		20DEG-90DEG
11	Min.V-Score PCB Thickness	0.4mm
		0.016"
12	N/C Routing Tolerance	±0.075mm
		±0.003"
13	Min.Blind/Buried Via	0.1mm
		0.04"
14	Plug Hole Size	0.2mm--0.6mm
		0.008"--0.024"
15	Min.BGA PAD	0.18mm
		0.007"
	Materials	FR4, Aluminium, Metal base substrate, Copper-clad laminate, Ceramic substrate, High Tg, Halogen-free, Rogers, Teflon, ISOLA, TUC, EMC, Nanya, ITEQ, Shengyi, KB
17	Surface Treatment	LF-HAL, ENIG,ImAg,ImSn, OSP, Gold plated, E NIG+OSP,HAL+G/F, ENEPIG
18	Warp & Twist	≤0.5%

19	Open/Short Electrical Testing	50--300V

20	Solderability Testing	245±5℃,3sec Wetting area least95%
21	Thermal Cycling Testing	288±5℃,10sec,3cycles
22	Ionic Contamination Testing	Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23	Soldmask Adhesion Testing	260℃+/-5, 10S，3times

Capabilities

PCB process capability

PCBA process capability

Rigid-Flex process capability

Metal Base PCB process capability

HDI process capability

Flexible PCB Capability

PCB Technological Process

PCBA producing process

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