A surface mount technology (SMT) stencil may also be called a PCB stencil, solder paste stencil, or laser stencil. An SMT Stencil’s main purpose is to simply transfer the solder paste to a bare circuit board. A stainless steel foil is laser cut to create an opening for each surface mount device on the board. Once the printed circuit board (PCB) stencil is properly aligned with the top of the board, the solder paste is applied over the openings (in a single pass, with a metal squeegee). When the stainless steel foil detaches from the board, solder paste remains, ready for the manufacture of the surface-mount device (SMD). In contrast to manual soldering procedures, this process ensures consistency and saves time.
Mass production lead time
| lead time Level | Lead Time (Wroking days,ex-factory | |
| Urgent(hours) | Normal(days) | |
| ALL | 6-12 | 2-3 |
The above lead time is based on:
1.Conventional Material
2.All engineering consultations is confirmed
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