High-frequency high-speed PCB-Shenzhen Honlynn Circuit Co., Ltd.

High-frequency high-speed PCB

High-frequency high-speed PCB

What is a high-frequency high-speed circuit board? In simple terms, a high-frequency and high-speed circuit board is a specially designed and manufactured printed circuit board for processing high-frequency analog signals and/or high-speed digital signals. It is not just an ordinary PCB, but a "special PCB" that has extremely high requirements for materials, design, and craftsmanship. High frequency: Typically referring to the field of analog radio frequency, it focuses on the periodic changes of signals, such as wireless communication (5G, Wi-Fi, Bluetooth), radar, satellite communication, etc. The operating frequency usually ranges from hundreds of MHz to tens of GHz or even higher. High-speed: Typically referring to the digital domain, it focuses on the signal transition edges (rise/fall time). When the transition time of a digital signal is short enough to match the time it takes for the signal to travel on a PCB, "high-speed" effects must be considered. Examples include high-speed processors, FPGAs, servers, data center switching, and so on. In practical applications, high frequency and high speed often coexist, hence they are collectively referred to as high-frequency and high-speed circuit boards.

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Key technologies and materials for high-frequency and high-speed PCBs

1. Core materials

This is the fundamental difference from ordinary PCBs.

Low-loss board:

Characteristics: It possesses a **low and stable dielectric constant and an extremely low dielectric loss factor.

Common brands include Rogers, Taconic, Isola, and the Megtron series from Panasonic.

Compared to FR-4: FR-4 has an unstable Dk value and a high Df value, making it unsuitable for high-frequency and high-speed applications.

2. Design and wiring technology

Transmission line theory: It is necessary to use controllable impedance transmission lines, such as microstrip lines and striplines, and accurately calculate their geometric dimensions to achieve the target impedance.

Strict layered design: Provides a clear signal return path, reduces loop area, and controls impedance. Multiple ground layers and power layers are typically used.

Differential pair routing: For high-speed serial signals (such as PCIe, USB, SATA), it is necessary to use equal-length, equally-spaced, and symmetrical differential pair routing to enhance anti-interference capability.

Via optimization: Vias are the main source of impedance discontinuity. It is necessary to use back drilling to remove useless via stubs, or use blind buried via technology to reduce the impact of vias on the signal path.

Main application areas

Communication equipment: 5G base stations/antennas, optical transmission network equipment, microwave relay equipment.

Data center and computing: high-end servers, routers, switches, AI accelerator cards.

Automotive electronics: millimeter-wave radar, in-vehicle infotainment systems, advanced driver assistance systems.

Aviation, Aerospace, and Defense: Radar Systems, Satellite Communications, Electronic Warfare Equipment.

High-end testing instruments: network analyzer, high-speed oscilloscope.

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DELIVERY TIME

Prototype sample lead time

lead time Level	Lead Time (Wroking days,ex-factory)
lead time Level	Urgent(hours)	Normal(days)
1、2L	24	3-4
4L	48	7-8
6、8L	72	7-10
10L and up	To be determined based on case

The above lead time is based on:

1.Conventional Material

2.All engineering consultations is confirmed

PCB

High-frequency high-speed PCB

Quick-turn PCB

Multilayer PCBs

High-Tg PCB

Halogen-Free PCB

Heavy Copper PCB

HDI PCB

Metal Core

Ceramic PCB

Special Base PCB

Enepig PCB

Rigid-Flex PCB

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